Dr. Marion and Jane Schafer Packaging Scholarship

The intent of this scholarship is to provide support to students pursuing their undergraduate degree in the Bailey College of Engineering and Technology. This scholarship also serves to honor and celebrate the legacy of Dr. Marion Schafer and the positive impact he made at Indiana State University through his philanthropy and a lifelong commitment to our campus and community.

Recipients must demonstrate financial need; 1st recipient must be an incoming freshman with a Packaging Engineering Technology major or minor; preference to a student who has participated in a credited or non-credited packaging course at Indiana State (essay required); 2nd recipient must have transferred to the Packaging Engineering Technology program major or minor from another program at Indiana State; recipient must have completed or be currently enrolled in Packaging 180 or 280 course.

Award
$1,000.00
Deadline
03/01/2026
Supplemental Questions
  1. For freshmen only: Why are you interested in the Packaging Engineering Technology program at Indiana State University? Is there a specific job within the packaging industry that interests you the most? Have you participated in any Indiana State University led packaging events or courses during high school? If so, how did it affect your decision in choosing packaging as a career?
  2. Have you participated in a credited or non-credited packaging course at Indiana State University?
  3. Have you completed or are you currently enrolled in Packaging 180 or Packaging 280?
  4. Have you switched to the Packaging Engineering Technology program from another major or minor? If so, which one?