Paperboard Packaging Alliance Annual Scholarship

The intent of this scholarship is to provide annual support to students at Indiana State University, and to support the Packaging Engineering Technology program in the Bailey College of Engineering and Technology.

Recipients must demonstrate financial need; recipients must intend to participate in the Student Design Challenge in the Packaging Engineering Technology program in the academic year of the scholarship award; recipients must be a junior or senior; recipients must have a GPA of at least 3.0; recipients must be pursuing a major, minor, or certificate within the Packaging Engineering Technology program.